Industry News: bga crack ball package (Page 8 of 16)

Machine Vision Products to demonstrate Supra E AOI and Microelectronics inspection capabilities at Nepcon China 2012

Industry News | 2012-04-24 08:13:12.0

April 24, 2012 Machine Vision Products (MVP), a leader in Automated Optical Inspection, will be demonstrating their latest Supra E and Ultra 850G Microelectronics AOI at Nepcon China in Shanghai from April 25th to April 27th. As leaders in price and performance AOI, MVP has demonstrated a high degree of adaptability of their systems throughout the 18 years of service to the industry. MVP will be exhibiting at Stand 1C65.

Machine Vision Products, Inc

EasySpheres LLC Launches New E-commerce Web Site

Industry News | 2010-03-04 11:30:26.0

POWAY, CA — March 2010 — EasySpheres recently finalized and opened an enhanced Web-based ordering portal for customers interested in purchasing solder balls and/or solder spheres for BGA rework applications and low-volume manufacturing.

EasySpheres LLC

PDR Releases Re-Ball Mode Software as Part of ThermoActive Software Suite

Industry News | 2019-03-03 18:54:54.0

PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.

PDR-America

Test Strategies for High Density Packages Course Presented at EtroniX 2001

Industry News | 2001-02-01 09:07:37.0

Yervant Zorian, Chief Technology Advisor of LogicVision Inc., will present a course entitled, "Test Strategies for High Density Packages" in the EvaluTech Conference at EtroniX 2001.

Reed Exhibitions - RX (Reed Exhibitions)

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com

New High Thermal & Impact Reliability Solder and Water Soluble Flux from SHENMAO

Industry News | 2018-06-03 19:11:33.0

SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.

Shenmao Technology Inc.

Practical Components Adds 0.3 mm Pitch Dummy CVBGA Test Vehicle to Lineup

Industry News | 2011-11-08 14:17:32.0

Practical Components introduces a dummy (mechanical sample) version of Amkor’s cutting-edge CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

EasySpheres Solder Spheres – Any Size, Any Alloy, Overnight

Industry News | 2021-06-02 05:34:04.0

EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.

EasySpheres LLC

PDR's New Affordable PCB X-ray Inspection Systems Offer Quality Image Clarity

Industry News | 2020-06-07 04:44:33.0

PDR X-ray Solutions is pleased to announce that its 2D and 2D+ X-ray systems have set a new industry standard for high-quality X-ray images at an affordable price. Choosing the correct system for your requirements such as X-ray for quality control or X-ray for process control is vital for the success of both X-ray circuit board inspection programs as well as X-ray semiconductor inspection programs.

PDR-America

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix


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