Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2021-05-21 03:56:59.0
LED lamp bead because of energy saving, low carbon environmental protection, no strobe, no radiation, high brightness, low heat advantages are gradually replacing the fluorescent lamp on the market, its application scope is expanding,although LED has many advantages, if the production or operation is not appropriate,there will be LED strip use fault phenomenon. LED lamp strip manufacturers also begin to pay more and more attention to the problem of production quality, then what equipment can be used for LED lamp strip backlight detection? Unicomp Technology here recommended AX8200L LED strip backlight detection equipment.
Industry News | 2009-03-06 14:54:52.0
Everett Charles Technologies will display advanced technologies in booth A44 at the upcoming Bits BGA Socket Workshop, scheduled to take place March 8-11, 2009 at the Hilton Phoenix East/Mesa Hotel Mesa in Arizona.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
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