Industry News: bga failure (Page 1 of 13)

MIRTEC Europe and pb tec solutions to Display Revolutionary 2D/3D AOI Technology at SMT/Hybrid/Packaging 2015

Industry News | 2015-04-07 11:25:45.0

MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.

MIRTEC Corp

SMTA Boston Offers Flip Chip and BGA Workshop

Industry News | 2003-03-20 09:03:05.0

Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.

Surface Mount Technology Association (SMTA)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-17 19:05:42.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Industry News | 2013-07-19 11:33:18.0

IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.

Association Connecting Electronics Industries (IPC)

SMTA Releases Free BGA Defect Guide for Download

Industry News | 2019-05-20 18:57:09.0

SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers - Deadline Approaches

Industry News | 2003-02-18 09:39:06.0

Encourages You to Submit an Abstract for this Year's Conference

Surface Mount Technology Association (SMTA)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

Early Bird Deadline Approaching For SMTA Boston Academy

Industry News | 2009-03-12 18:15:08.0

SMTA Boston will be held April 22-23, 2009 at the Boston Convention Center in conjunction with Electronics New England and NEPCON East.

Surface Mount Technology Association (SMTA)

Technical Papers Take Top Honors at IPC APEX EXPO Winning Papers to be Presented at Technical Conference

Industry News | 2013-02-14 08:18:47.0

IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013

Association Connecting Electronics Industries (IPC)

Precision PCB Services, Inc. geared to offer training and consulting services Worldwide.

Industry News | 2009-02-03 13:34:04.0

New PCB Rework, Repair, Fabrication Training & Consulting Services.

Precision PCB Services, Inc

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