Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2021-04-01 08:12:08.0
SHENMAO is pleased to announce that it has established an independent testing laboratory in Taiwan called Cheetah Inspection Inc. The ISO/IEC 17025 approved testing laboratory is located in Hsinchu, and builds upon SHENMAO's 48 years of packaging and assembly experience.
Industry News | 2010-09-03 03:48:15.0
Bob Willis will be presenting a hands on x-ray inspection workshop with FREE x-ray book and the chance to win x-ray inspection CDs and inspection posters.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2004-09-27 17:12:27.0
High-Resolution X-Ray Inspection Under $60K
Industry News | 2023-01-09 18:34:46.0
SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.
Industry News | 2023-09-25 18:29:12.0
PDR is pleased to announce its participation in the SMTA Guadalajara Expo, scheduled to take place Wednesday, Oct. 25, 2023 in SMTVYS Technology's Booth 505 at Expo Guadalajara in Guadalajara, Jalisco. PDR is set to showcase its cutting-edge IR-E3 Series of SMD/BGA IR rework systems, as well as its industry-leading X-ray solutions.
Industry News | 2017-03-06 05:20:47.0
For over 30 years we have been offering hands-On and theory workshops in all aspect of electronic assembly. From practical skills like manual soldering, component handling plus wiring and assembly to the most advanced area array, flip chip and laser soldering technology http://www.bobwillis.co.uk
Industry News | 2012-11-29 13:46:02.0
In October, Universal Instruments Corporation’s Advanced Process Lab (APL) held its third Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2012 at Binghamton University’s Innovative Technologies Complex in Vestal, N.Y. The 25-member consortium, organized by Universal, helps member organizations identify and develop new and emerging technologies, generating applicable knowledge for specific product development and manufacturing processes.
