Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2022-11-28 07:00:51.0
With the development of the precision and stability of SMT equipment, the manufacturing process and testing links have gradually become the key to the development of the industry. At the same time, the fierce competition in the consumer electronics market has put forward higher requirements for the quality of electronic components. In the production process, it is necessary to use various testing technologies to inspect defects and faults in time and repair them, among these testing technologies, X-ray inspection is one of the most critical process to improve the SMT BGA QFN soldering quality.
Industry News | 2014-02-27 11:48:51.0
Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.
Industry News | 2014-04-02 20:56:21.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.
Industry News | 2017-10-18 20:31:57.0
YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.
Industry News | 2010-09-14 17:17:30.0
Acculogic’s Manufacturing Test Systems Division, a global leader in electronics test and production solutions, introduces its ThermoScan™ test technology. The ThermoScan™ sensor can be installed on a flying probe shuttle for general application or a probe module with Z-movement for more accurate measurement over the integrated circuits (ICs).
Industry News | 2012-05-15 10:17:11.0
Rochester Institute of Technology has partnered with equipment supplier MARTIN to utilize a MARTIN Expert 10.6 Rework Station and Mini-Oven unit in its Center for Electronics Manufacturing and Assembly (CEMA)
Industry News | 2012-11-26 14:13:04.0
Macrotron Systems enhances its best value EMS service offering.
Industry News | 2013-01-14 11:12:13.0
STI Electronics, Inc. will exhibit in Booth #1605 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. STI Electronics will highlight all aspects of the company, including Engineering Services, Training Resources and Manufacturing Assembly Supplies.
Industry News | 2013-07-18 11:33:13.0
STI Electronics, Inc. will exhibit at the Space & Missile Defense (SMD) Symposium, scheduled to take place August 12-15, 2013 at the Von Braun Center in Huntsville, AL.
