Industry News | 2009-02-03 13:34:04.0
New PCB Rework, Repair, Fabrication Training & Consulting Services.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2017-03-06 05:25:35.0
Many of the webinars we present every month are available from our online archive. The video recordings and a copy of the slides can be provided for you or why not organise an education session with members of your team in a conference room so you can also discuss the subject after the session to implement your process improvements
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
Industry News | 2013-02-08 23:26:44.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4, that is extraordinarily crack resistant, to withstand flexing experienced by flexible printed circuitry or drops and shocks of very thin printed circuit assemblies.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2013-06-12 11:38:59.0
STI Electronics, Inc. announces that it will exhibit at the SMTA Space Coast Expo & Tech Forum, scheduled to take place Thursday, June 13, 2013 at the Melbourne Auditorium in Melbourne, FL.
Industry News | 2013-09-12 14:29:04.0
STI Electronics, Inc. announces that it will exhibit in Booth #301 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2013-01-14 11:12:13.0
STI Electronics, Inc. will exhibit in Booth #1605 at the upcoming IPC APEX EXPO, scheduled to take place February 19-21, 2013 at the San Diego Convention Center in California. STI Electronics will highlight all aspects of the company, including Engineering Services, Training Resources and Manufacturing Assembly Supplies.
