Industry News | 2009-07-30 21:06:08.0
In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.
Industry News | 2024-08-12 15:07:45.0
SHENMAO America, Inc. is pleased to announce the launch of its latest innovation, the Rosin-Free No-Clean Liquid Flux SM-ZR10, specifically designed for automatic wave soldering processes. The no-clean liquid flux offers superior soldering performance, easy maintenance, and compliance with stringent environmental standards.
Industry News | 2016-06-01 15:30:00.0
Spokane Valley, Washington,— Hentec Industries, Inc. (formerly RPS Automation LLC), a manufacturer of precision soldering automation equipment for electronics assembly and manufacturing, today announced the release of the latest generation of solderability test systems; The Photon Steam Aging System and Pulsar Solderability Test System.
Industry News | 2012-10-12 04:01:50.0
Package On Package Assembly Inspection & Quality Control Guide is the first text book covering every step in this exciting manufacturing and design lead technology and its going to be available FREE.
Industry News | 2015-12-14 22:14:22.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2015-12-16 18:10:21.0
SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature–sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
Industry News | 2023-01-09 18:34:46.0
SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.
Industry News | 2008-02-11 15:49:48.0
GREELEY, CO � February 8, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, announces the NC162 SN100C� No-Clean Flux.
Industry News | 2022-01-03 13:42:54.0
The biggest challenge of 2021 has been the impact of material shortages many of our customers experienced due to supply chain issues which appears to be gradually easing.
