Industry News: bga i have a zevatech 570 (Page 1 of 9)

The Electronics Industry Loses a Consummate Professional

Industry News | 2009-09-26 15:37:45.0

Barry O’Brien died on Sunday, September 20, 2009 while bike riding. Barry covered the Ohio territory for Horizon Sales, a manufacturer’s representative corporation supplying machinery and supplies to the electronics industry.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Precision PCB Services, Inc. Takes on the Shuttle Star Line of BGA Rework Equipment

Industry News | 2012-03-29 12:06:03.0

Precision PCB Services, Inc. to provides sales, service, support and training for the Shuttle Star Line of BGA Rework Equipment.

Precision PCB Services, Inc

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

Exposed Vias in BGA Pads

Industry News | 2018-10-18 10:26:46.0

Exposed Vias in BGA Pads

Flason Electronic Co.,limited

Basic Soldering Guide – How to Solder Electronic Components

Industry News | 2018-12-08 03:25:54.0

Basic Soldering Guide – How to Solder Electronic Components

Flason Electronic Co.,limited

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

How Electronic / Electrical Circuit Works

Industry News | 2018-12-08 03:33:27.0

How Electronic / Electrical Circuit Works

Flason Electronic Co.,limited

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