Industry News: bga land pattern (Page 6 of 13)

Deanne Herman Celebrates Five-Year Anniversary with Practical Components

Industry News | 2010-07-07 11:20:39.0

LOS ALAMITOS, CA - Practical Components Inc., a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces the fifth anniversary of Deanne Herman.

Practical Components, Inc.

7 Common PCB Design Mistakes

Industry News | 2019-11-05 22:05:41.0

The printed circuit board, or PCB, is responsible for connecting all the components with each other in your electronic assembly. Making just one tiny error in the design could lead to complete failure. PCB layout design requires ardent precision and great technological skills.

Headpcb

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:15:55.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:17:14.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

Get a Free ERSA Mobile Scope with Purchase of ERSA Rework System

Industry News | 2011-10-28 20:29:08.0

ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.

kurtz ersa Corporation

PACE to Showcase New TF Series of BGA Rework Systems at IPC APEX EXPO 2019

Industry News | 2019-01-22 16:00:09.0

At IPC Apex 2019, PACE Worldwide will showcase their new TF Series of BGA Rework Systems. The TF1800 is designed for standard board sizes of up to 12” x 12”, while the TF2800 is for extra large, high mass PCB’s up to 24” x 24”.

PACE Worldwide

Japan Unix Can Reduce PCB Burning Issues with Optimal Laser Shape Rings

Industry News | 2015-06-02 13:26:13.0

Japan Unix introduces laser shape rings. Choosing the best laser spot shape to fit components and land shapes can reduce circuit board problems.

Japan Unix Co., Ltd.

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

NEW ARIES SHORTFORM CATALOG COVERS PIN BALL BGA

Industry News | 2004-11-10 18:04:10.0

Frenchtown, NJ, November 2004

Aries Electronics Inc

Bob Willis PoP and BGA Inspection Webinars sponsored by Nordson DAGE

Industry News | 2010-08-27 07:25:03.0

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and with it placing further demands on assembly engineers.

ASKbobwillis.com


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