Industry News: bga lf hasl (Page 1 of 1)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Practical Components to Highlight Latest Technology at SMTA International 2007

Industry News | 2007-10-04 23:11:30.0

LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.

Surface Mount Technology Association (SMTA)

Now Available, SIPAD LF

Industry News | 2003-04-01 06:22:27.0

Lead Free SIPAD ssd

SIPAD Systems Inc.

Multicore LF700 Solder Paste from Henkel Offers Exceptional Lead-free, Halide-free Performance

Industry News | 2009-06-02 14:13:36.0

With the majority of the electronics industry fully on board with lead-free manufacturing, solder paste materials requirements are now moving beyond basic functionality and toward more advanced, truly enabling capabilities.

Henkel Electronic Materials

Innovation Wins Big at APEX: Henkel R&D Commitment Results in Impressive Awards Haul

Industry News | 2009-04-09 22:35:29.0

The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.

Henkel Electronic Materials

Christopher Associates/Koki Solder to Present Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes at SMTAI 2010

Industry News | 2010-09-29 23:32:58.0

Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

Practical Components to Display Latest Technology at Productronica 2007.

Industry News | 2007-10-30 01:07:14.0

LOS ALAMITOS, CA � October 30, 2007 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston GmbH�s booth in Halle A4/Stand 480 at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

Practical Components, Inc.

National Electronics Week 2015 – First Glimpse at the Floor Plan

Industry News | 2014-06-25 16:44:39.0

National Electronics Week is excited to publish their first look at the 2015 floor plan. With The Pavilion Hall booked for next year’s show there is over 400 extra square meters on the show floor up for grabs this time around. Not only that but with the return of our 4 Sector partners running the technical content seminars there will be more to see than ever before.

NEW Events Ltd

Nihon Superior’s Keith Sweatman to Present at SMTA International

Industry News | 2012-09-17 16:26:16.0

Nihon Superior, has announced details of its participation in the Technical Program of SMTAI 2012

Nihon Superior Co., Ltd.

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