Industry News | 2003-03-11 08:16:17.0
Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.
Industry News | 2008-08-11 23:45:48.0
OXFORD, CT � August 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it will display the MV-7L In-Line AOI System in booth 424 at the upcoming SMTA International exhibition and conference, scheduled to take place August 19-20, 2008 in Orlando. FL.
Industry News | 2008-04-07 22:15:22.0
OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.
Industry News | 2008-07-19 15:38:37.0
OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2023-08-17 14:26:37.0
Today, KINGSUN shares with you the common types and classifications of SMT mounters.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2008-09-02 15:34:36.0
Minneapolis, MN � The 2008 Charles Hutchins Educational Grant recipient, Lei Nie, a graduate student in the field of Mechanical Engineering at the University of Maryland, has been selected by the SMTA Grant Committee for her project entitled "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process".
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
