Industry News | 2010-10-06 11:52:25.0
FINETECH/MARTIN announces that it will host the upcoming SMTA Boston Chapter meeting on Tuesday, October 12, 2010 at its facility in Manchester, NH. Joe Belmonte, Principal Consultant at ITM Consulting, will present "Considerations in Miniature SMT Component Assembly."
Industry News | 2019-03-03 18:54:54.0
PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.
Industry News | 2021-08-13 08:37:00.0
Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above specified limits. The system can also verify the coating thickness. Defense base customers often require XRF verification testing of components after components have been processed through lead-free to leaded solder alloy exchange for tin mitigation applications. XRF testing may also be required to verify RoHS compliance of components that have been re-balled or re-processed for lead-free applications. In addition to XRF testing, Circuit Technology Center also supports ionic cleanliness testing, X-ray, Acoustic Microscopy, Solderability, and BGA ball shear testing services.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2009-04-02 09:23:02.0
Economic woes � Chinese companies vie for increased sales
Industry News | 2012-06-04 11:39:23.0
MARTIN has expanded its successful EXPERT 04.6 rework station series with a new configuration to rework LEDs and power components on heavy (metal or ceramic) boards.
Industry News | 2012-09-10 09:15:27.0
MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.
Industry News | 2013-05-28 14:45:16.0
Finetech & Martin announce the appointment of Al Cabral as Regional Sales Manager.
Industry News | 2021-11-12 04:07:03.0
Circuit Technology Center announces it has released an updated version of its popular Bonding System.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA USA
Phone: (888) 406-2830
