Industry News | 2022-02-25 13:26:18.0
Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN) is pleased to announce that it has setup a brand new Assure™ intelligent X-ray component counter at its Northeastern USA demo location for live demos. The demonstration center in Haverhill MA, Circuit Technology Center, Inc., is recognized as the world's most innovative specialist in circuit board rework.
Industry News | 2018-11-27 07:02:53.0
Naprotek today announced plans to exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 28, 2018 at Bestronics, Inc. in San Jose, CA.
Industry News | 2018-10-17 19:34:14.0
Naprotek, Inc.today announced that it was awarded a 2018 Global Technology Award in the category of Contract Services
Industry News | 2013-07-05 17:24:15.0
SMART Group announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.
Industry News | 2008-04-07 21:16:55.0
FINETECH announces that it will display the FINEPLACER� CRS7.MD system at the upcoming NEPCON China 2008 trade show and exhibition, scheduled to take place April 8 to 11, 2008, in Shanghai, China.
Industry News | 2022-09-26 06:59:48.0
EasySpheres received a 2022 Mexico Technology Award in the category of Solder Spheres for its Tape-and-Reel Spheres. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2012-04-27 14:46:36.0
The Balver Zinn/Cobar Group introduces Tempotac (120-TEM), its newest next-generation tacky flux.
Industry News | 2013-01-24 07:34:04.0
VJ Electronix, Inc announces the installation of a new 400ST Automated Scavenger System into BEST’s Rolling Meadows, IL facility.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
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