Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2010-05-07 16:01:14.0
New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Industry News | 2009-01-23 19:18:23.0
You are invited to submit a paper to the electronic industry's premier forum on the manufacture of electronic products utilizing surface mount and related technologies.
Industry News | 2013-01-19 07:46:16.0
Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics
Industry News | 2010-11-24 13:47:37.0
Multitest's board division has successfully introduced a new LCR (layer count reduction) concept for high pin count BGA applications. Board customers now will benefit from significant cost savings without sacrificing performance. With the new LCR concept, the layer count of standard pitch BGA boards can be reduced by up to 40 percent.
