Industry News: bga reflow profile (Page 1 of 103)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

SMTnet

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

Noncontact Switching Comes to Confined Spaces

Industry News | 2003-03-26 08:25:40.0

The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Mydata Agilis Feeders, Magazines & More For Sale

Industry News | 2015-04-20 08:04:30.0

The bidding for Baja Bid’s latest online auction is OPEN and will begin CLOSING at 1pm EST on April 23, 2015.

Baja Bid

Reflow oven zone temperature set up and thermal profile

Industry News | 2018-10-18 08:42:00.0

Reflow oven zone temperature set up and thermal profile

Flason Electronic Co.,limited

How to optimize the reflow profile?

Industry News | 2018-10-18 08:37:41.0

How to optimize the reflow profile?

Flason Electronic Co.,limited

  1 2 3 4 5 6 7 8 9 10 Next

bga reflow profile searches for Companies, Equipment, Machines, Suppliers & Information