Industry News | 2011-10-25 00:31:18.0
Aqueous Technologies announces that CEO Michael Konrad was voted Best Paper by delegates at the recent SMART Group Conference at the Oxfordshire Golf Club in Thame, UK.
Industry News | 2008-10-07 12:56:56.0
APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.
Industry News | 2011-09-19 13:31:20.0
STI Electronics introduces its new Micro-Coil Spring Array as an improved alternative to standard rigid arrays.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2014-05-08 10:42:32.0
Visual Inspection Instrument manufacturer Optilia Instruments AB announces the appointment of Ascentech LLC as North American Distributor. The agreement encompasses Optilia's BGA solder Inspection system and high-definition (full HD) camera inspection systems to the electronics manufacturing industry.
Industry News | 2021-02-17 11:49:45.0
A full range of automated selective soldering machines, component lead tinning machines and solderability test equipment will be on exhibit.
Industry News | 2021-11-29 14:55:05.0
A full range of automated selective soldering machines, component lead tinning systems and solderability test equipment will be on exhibit.
Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2013-05-01 20:51:31.0
Metcal today announced an additional date for its 2013 Spring series of BGA rework and repair seminars, this time co-hosting with Nikon and Nordson ASYMTEK.
