Industry News | 2023-11-20 13:47:24.0
MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.
Industry News | 2023-07-19 09:52:10.0
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.
Industry News | 2022-07-16 08:39:50.0
SHENMAO America, Inc. is pleased to announce that the PF918-S Lead-Free BGA Sphere features the newly designed high-reliability alloy PF918 that can achieve tensile strength performance 1.4 times higher than the typical SAC305 alloy.
Industry News | 2021-05-04 13:53:27.0
Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2011-10-03 17:04:22.0
Nordson DAGE announces that Kamran Iqbal will present “Measuring the Reliability Risk of PCB Pad Craters” at the SMART Group BGA and Cleaning Reliability Conference.
Industry News | 2021-08-25 16:20:31.0
Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-09-07 11:14:42.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-10-18 12:49:19.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2022-03-07 16:53:18.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
