Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2014-09-23 11:18:59.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Industry News | 2014-07-24 10:09:05.0
With this new Release, Viscom introduces numerous innovations and improvements in the area of inspection plan generation and analysis software for its inspection systems.
Industry News | 2022-01-24 18:01:46.0
Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.
Industry News | 2021-05-18 14:19:48.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Industry News | 2014-05-07 10:51:17.0
Indium Corporation technology experts will present at the IPC Southeast Asia High Reliability Conference May 28 in Singapore.
Industry News | 2008-01-28 23:33:58.0
Agilent Technologies Inc. (NYSE: A) today unveiled the industry's first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, here in Santa Clara, Feb. 4-6, 2008, Booth 305.
Industry News | 2014-08-06 12:33:35.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present at the 15th International Conference on Electronic Packaging Technology (ICEPT) Aug. 12-15 in Chengdu, China.
Industry News | 2022-09-15 06:27:38.0
The Assembly Division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will present the technical paper: "Edge Bonding as Viable Reinforcement For Solder Joints in High Reliability Applications" at the SMTA Penang Chapter Expo & Technical Forum 2022 taking place from September 21 - 22 in Penang, Malaysia.
Industry News | 2015-10-22 16:43:19.0
SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.
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