Industry News | 2010-11-30 13:30:04.0
Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.
Industry News | 2024-11-25 14:28:40.0
SHENMAO America, Inc. is excited to introduce its Lead-Free Solder Paste PF606-P, designed specifically for the "Reverse Hybrid" assembly process. This new approach is revolutionizing board assembly technology by offering a superior alternative to traditional low-temperature soldering techniques, enhancing both yield rates and reliability.
Industry News | 2015-11-16 10:47:48.0
Catching up with PNC with Dan Beaulieu, D.B. Management Group
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