Industry News: bga solder joint fillets (Page 22 of 25)

The System of X-ray Radiography Non-destructive Testing technology

Industry News | 2021-11-30 01:54:12.0

After more than 100 years of development, X-ray imaging technology has formed a relatively complete X-ray non-destructive testing (NDT) technology system. In order to meet these needs, new detection technologies are constantly innovating, using Xray inline inspection technology. It can not only detect invisible crack or porosity such as aluminum casting , but also qualitatively and quantitatively analyze the detection results to find flaws early.

Unicomp Technology Co., Ltd

Viscom Wins Mexico Technology Award for Automatic 3D X-ray System

Industry News | 2018-11-16 15:48:54.0

Viscom announces that it was awarded a 2018 Mexico Technology Award in the category of Inspection Equipment – X-ray for its X7056-II automatic 3D X-ray inspection system. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Viscom AG

SMART Group Hosts Successful “Back to Basics” Rework & Inspection Workshop

Industry News | 2013-04-03 18:52:22.0

SMART Group,announces that on 26th March 2013, more than 30 delegates from manufacturing and service repair sectors, including line managers, process and quality engineers, attended its successful “Back to Basics” Hands-on Rework and Inspection Workshop at the Manufacturing Technology Centre in Coventry, UK

The SMART Group

Plan your engineering process improvement with a monthly online webinar

Industry News | 2017-04-13 06:06:32.0

Solderability Benchmarking, Failures & Testing Methods 14th August All our webinars are based on 2.30pm UK time go to https://www.bobwillis.co.uk/events/ Benchmarking you PCB surface finish or the impact of baking boards or components can be simple in production and the laboratoy. Long term solderability of component terminations and printed circuit boards is fundamental in modern assembly processes. This is all practical experience not just theory for the presenters countless studies in industry

ASKbobwillis.com

Electronica South China 2020 invitation from Unicomp Technology

Industry News | 2020-10-24 02:04:11.0

On November 3rd to 5th, 2020,Unicomp Technology will bring the latest technology and products to the ELECTRONIC SOUTH CHINA 2020,Welcome to visit the Unicomp Technology booth at 9D30,Hall 9. Shenzhen International Convention and Exhibition Center!

Unicomp Technology Co., Ltd

Nepcon Asia 2021--Unicomp Technology release newest Inline Planar 3D CT X-ray

Industry News | 2021-10-15 04:53:02.0

NEPCON ASIA (ASIA Electronics Manufacturing Equipment and Microelectronics Industry Exhibition) is a well-known professional exhibition in the Asian electronics manufacturing industry, which will be held the Shenzhen Convention and Exhibition Center from Oct 20 to Oct 22, 2021. NEPCON ASIA 2021 will bring together 1,200 global enterprises and brands in the field of electronics to participate in the exhibition, covering PCBA process, smart factory, new equipment and technical solutions related to automotive electronics. About 70,000 purchasing decision-makers from Asian electronics manufacturing clusters in industrial control, automotive electronics, communications, new energy, smart city and medical electronics are expected to attend the exhibition to implement purchasing plans, industry investigations and technical exchanges. Unicomp as the leader in the intelligent EMS & SMT inspection equipment developer and manufacturer, will showcase 5 models of X-Ray systems, cordially welcome to visit Unicomp and learn more about Unicomp electronics X-Ray machine at the Booth No. 1A35, Hall 17.

Unicomp Technology Co., Ltd

Lead-Free (Pb-Free) Solder and Composition

Industry News | 2018-12-08 03:38:44.0

Lead-Free (Pb-Free) Solder and Composition

Flason Electronic Co.,limited

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

Keith Bryant to Present on Behalf of YXLON International at productronica

Industry News | 2017-10-18 20:31:57.0

YXLON International is pleased to announce that Keith Bryant, Global Direcompany of the Swiss tech holding, Comet Grouptor Electronics Sales, has been selected to present during productronica Messe München in Germany. Bryant will speak during the SMTA Technical Program in the SMT Speakers Corner (A1.220) on Thursday, Nov. 16, 2017 from 1-1:30 p.m. The presentation will look at the advantages that cross over X-ray systems, like the YXLON FF35 CT, bring to CT imaging in electronics failure analysis and in-depth fault finding. Bryant will discuss the latest technologies and show stunning reconstructions.

YXLON International


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