Industry News | 2015-03-11 18:05:46.0
The SMTA Capital Chapter is pleased to announce Donald Tyler, Managing Director, Corfin Industries, will present “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” at its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164.
Industry News | 2015-02-04 18:05:58.0
he SMTA Capital Chapter is pleased to announce its first meeting of 2015 on March 17th, scheduled from 5:30 pm to 8:00 pm at EIT (Main Building Lunchroom), 108 Carpenter Drive, Sterling, VA 20164. The focus of this chapter meeting will be “Elimination of Pb-Free Risk by Robotic Hot Solder Dip (RHSD)” presented by Donald Tyler, Managing Director, Corfin Industries.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2022-09-26 06:59:48.0
EasySpheres received a 2022 Mexico Technology Award in the category of Solder Spheres for its Tape-and-Reel Spheres. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2010-03-04 11:30:26.0
POWAY, CA — March 2010 — EasySpheres recently finalized and opened an enhanced Web-based ordering portal for customers interested in purchasing solder balls and/or solder spheres for BGA rework applications and low-volume manufacturing.
Industry News | 2021-06-02 05:34:04.0
EasySpheres is the exclusive worldwide provider of high quality, first run solder balls at reasonable quantities and excellent prices. The company is a leading provider and technical guide to many of the solder attach and bumping challenges that customers face today.
Industry News | 2010-09-26 16:12:24.0
STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that its BGA Reballer Kit allows components to be reused.
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
