Industry News: bga solder spheres sds (Page 3 of 15)

New Low Temperature Solder Paste from SHENMAO at SMTA Ohio

Industry News | 2018-07-08 18:45:56.0

SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.

Shenmao Technology Inc.

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2015-10-22 16:43:19.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Exhibits at ECTC in Las Vegas June 1-2, 2016 Booth 505 Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux

Industry News | 2016-05-24 20:29:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 7 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

SHENMAO Introduces SMF-WB02 / SMF-WB51 Water Soluble Flux At Semicon West 2016 Booth # 6467 in San Francisco

Industry News | 2016-07-11 20:50:22.0

SHENMAO SMF-WB02 / SMF-WB51 Water Soluble Flux are made locally in the USA and with the same quality in 9 other worldwide locations. It is said their Low Viscosity (easy to apply), High Tackiness (slump resistant), consistent printability for BGA and Micro BGA Ball Assemblies and excellent wash ability after high temperature reflow (255ºC and 60 sec over 220ºC) create highly reliable Solder Joints with optimum maximized Quality.

Shenmao Technology Inc.

PF606-P245 Lead-free Solder Paste Offers Continuous High-Speed Printability

Industry News | 2018-07-02 21:54:56.0

SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.

Shenmao Technology Inc.

PDR Rework Systems Announces New Integrated Reball System for Rework

Industry News | 2022-08-26 09:42:25.0

PDR test and X-ray inspection systems since 1985, today announced the release of the firm's new integrated Reballing system for all PDR Evolution Series Rework Systems.

PDR Rework

SHENMAO to Debut New Pastes & Fluxes at electronica China

Industry News | 2019-03-05 17:59:34.0

SHENMAO America, Inc. is pleased to announce that it will exhibit at electronica China, scheduled to take place March 20-22, 2019 at the Shanghai New International Expo Centre. The company will showcase its PQ10 series low temperature solder paste, new P250 series solder paste for automobile electronics, PW215 water soluble solder paste, SMF-WC53 water soluble ball-attach flux and solder sphere, and water-based wave soldering flux & water-based cleaner.

Shenmao Technology Inc.

SHENMAO Celebrates 50 Years of Developing Solder Materials

Industry News | 2023-01-09 18:34:46.0

SHENMAO America, Inc. today announced the company's 50th anniversary as a leading solder material manufacturer. As an award-winning supplier of electronics assembly and semiconductor packaging materials, the company has a reputation for its quality service.

Shenmao Technology Inc.

SHENMAO Awarded for Lead & Halogen-Free Solder Wire

Industry News | 2020-10-27 12:41:51.0

SHENMAO America, Inc. received a 2020 Mexico Technology Awardin the category of Solder – Bar & Wire for its PF606-F13 lead-free and halogen-free solder wire.The award was announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Shenmao Technology Inc.

New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues

Industry News | 2023-03-16 14:42:07.0

SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.

Shenmao Technology Inc.


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