Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2017-07-09 20:40:11.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2017-07-06 09:53:39.0
SHENMAO Technology introduces New Generation Ultra Low Residue Liquid Flux SMF-B51 with superior spray uniformity, excellent soldering performance and a wide process window for Chip Scale and Fan Out Wafer Level Packaging.
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2018-05-16 19:57:33.0
SHENMAO America today announced plans to exhibit at the SMTA Michigan Expo & Tech Forum, scheduled to take place Tuesday, May 22, 2018 at Laurel Manor in Livonia, MI. Company representatives will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 is designed to lengthen stencil life and eliminate head-in-pillow (HiP) defects, voids, slumping and non-wetting opens.
Industry News | 2018-06-03 19:11:33.0
SHENMAO America, Inc. is exhibiting at the 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), taking place May 29 - June 1, 2018 at the Sheraton San Diego Hotel & Marina. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys, and SMF-WC53 Water-Soluble / Cu-OSP Pad Ball Attach Flux.
Industry News | 2018-05-20 18:31:27.0
SHENMAO America today announced plans to exhibit at the eSMART Factory Conference, jointly organized by Global SMT & Packaging magazine and the SMTA, on Thursday, May 24, 2018 at the Plug ‘n Play Tech Center in Sunnyvale, CA. SHENMAO will highlight the new PF606-P245 Lead-free Zero Halogen Solder Paste. PF606-P245 paste improves ICT testability by completely removing flux to prevent contamination of test pins during test operation.
Industry News | 2018-10-22 18:35:12.0
SHENMAO Technology today announced plans to exhibit at the International Wafer-Level Packaging Conference, scheduled to take place Oct. 23-25, 2018 at the DoubleTree by Hilton San Jose in California. SHENMAO plans to showcase its new PF906-S and PF912-S solder alloys.
