Industry News: bga solder spheres sds (Page 10 of 12)

Nihon Superior to Present During the 2007 IPC/JEDEC International Conference on Lead-Free Electronics

Industry News | 2007-12-03 22:08:21.0

OSAKA, JAPAN � November 30, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will present during the IPC/JEDEC International Conference on Lead-Free Electronics and Tabletop Exhibition that is scheduled to take place December 3-5, 2007 at the Driskill Hotel in Austin, Texas.

Nihon Superior Co., Ltd.

SHENMAO Offers Low-Temperature Lead-Free Solder Paste for Sensitive Components

Industry News | 2022-04-13 10:04:24.0

SHENMAO America, Inc. is pleased to introduce its PF735-PQ10-10 Low Melting Point Lead-Free Solder Paste. Low-temperature solder paste has become more widely used in the assembly of surface mount technology devices because certain assemblies cannot withstand the same temperatures that are used for lead-free soldering, typically 240°-250°C. These high temperatures can damage sensitive components, causing warpage and other damage.

Shenmao Technology Inc.

SHENMAO Showcasing Liquid Flux and Low Temp Solder at SMTA Guadalajara

Industry News | 2019-10-08 06:12:57.0

SHENMAO America, Inc. is pleased to announce plans to exhibit at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 23-24, 2019 at the Expo Guadalajara. The company will show its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux in Booth #602.

Shenmao Technology Inc.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Industry News | 2019-10-24 16:29:44.0

SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

SHENMAO Awarded for New Low Temperature Solder at productronica

Industry News | 2019-11-13 11:33:38.0

SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.

Shenmao Technology Inc.

Advanced Liquid Flux and Low Temp Solder from SHENMAO at SMTA Silicon Valley Expo

Industry News | 2019-11-25 11:02:32.0

SHENMAO America, Inc. announces that it will exhibit at the SMTA Silicon Valley Expo, scheduled to take place Wednesday, Dec. 4, 2019 at the Bestronics Box Build Facility in San Jose, CA. The company will showcase its PF735-PQ10 Low Temperature Solder (LTS) and SM-862 Liquid Flux.

Shenmao Technology Inc.

SHENMAO's New Room Temperature Solder Paste Offers Stability for a Range of Temperature Conditions

Industry News | 2020-05-30 12:34:54.0

SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.

Shenmao Technology Inc.

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Industry News | 2018-04-25 20:05:59.0

SHENMAO America, Inc. today announced plans to exhibit in Booth 433 at SEMICON Southeast Asia, scheduled to take place May 22-24, 2018 at the new Malaysia International Trade & Exhibition Centre (MITEC) in Kuala Lumpur. SEMICON SE Asia is the region's premier gathering of the industry for connecting people, products, technologies and solutions across the global electronics manufacturing supply chain. SHENMAO plans to introduce its new PF906-S and PF912-S solder alloys.

Shenmao Technology Inc.

SHENMAO to Present at the 31st Annual Electronics Packaging Symposium

Industry News | 2019-08-12 20:00:01.0

SHENMAO America is pleased to announce that it will exhibit at the 31st Annual Electronics Packaging Symposium- Small Systems Integration, scheduled to take place Sept. 5-6, 2019 in Binghamton, NY. Watson Tseng, General Manager, SHENMAO America, will present “New-Generation, Low-Temperature Lead-Free Solder for SMT Assembly.”

Shenmao Technology Inc.

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH


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