Industry News | 2018-01-25 17:21:28.0
Precision PCB Services, Inc. the leader in the art of BGA Component Rework Services and Process Implementation will exhibit in booth #3752 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27-March 1, 2018 at the San Diego Convention Center. The company will demonstrate the Shuttle Star Model SV560A Split Vision BGA Rework Station. Don’t miss this chance to see the new industry standard in affordable Split Vision BGA Rework Stations. The Shuttle Star Line of BGA Rework Stations are totally self contained with the latest in PLC technology and touch screen programming. No need to have a bulky a personal computer to run this system and they require no external air. You simply plug them. They are ready to go and capable to rework the most complex circuit boards. Best of all they are supported by a company with over 27 years’ experience in the Electronics Manufacturing Industry. Since 1991 Precision PCB Services, Inc. has provided products, services, training and consulting for the assembly, rework and repair of printed circuit boards and electronic assemblies. Having mastered the art of BGA Component Rework, they now provide complete solutions and product lines to achieve a high yield in your rework process.
Industry News | 2019-03-14 11:28:14.0
Precision PCB Services, Inc. Opens New Texas Location
Industry News | 2010-07-15 14:19:11.0
Now an authorized distributor for Chip Quik products.
Industry News | 2017-02-05 10:18:08.0
The SMTA is pleased to announce its 2017 Educational Programming that includes conferences, webtorials and webinars, certification program and online training courses.
Industry News | 2007-10-04 23:11:30.0
LOS ALAMITOS, CA - September 25, 2007 - Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will display its latest technology in booth 510 at the upcoming SMTA International exhibition and conference, scheduled to take place October 7-11, 2007, in Orlando, FL.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2023-11-27 12:45:07.0
The Surface Mount Technology Association (SMTA) announces the release of several more webinars, photo libraries, and poster sets as part of a generous donation from renowned industry expert, Bob Willis.
Industry News | 2001-02-27 22:31:53.0
IPC has announced a call for papers for the IPC Annual Meeting, which takes place October 8-13, 2001, at the Rosen Centre Hotel in Orlando, FL.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
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