Industry News: bga void specification ipc (Page 3 of 16)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

SMTA International Conference Program Finalized and Registration Now Open

Industry News | 2013-06-11 19:23:26.0

The SMTA is pleased to announce that the program for SMTA International is finalized and available on-line at www.smta.org/smtai and registration is open.

Surface Mount Technology Association (SMTA)

BEST Releases 2nd Half Training Schedule for 2016

Industry News | 2016-05-25 18:26:38.0

BEST's 2nd half of 2016 schedule including more dates and classes in Detroit.

BEST Inc.

Nordson DAGE and Rockwell Collins Co-author Technical Paper on Voiding in Ball Grid Arrays

Industry News | 2011-09-23 22:09:26.0

Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.

Nordson DAGE

PNC Inc.’s BGA Assembly

Industry News | 2017-03-23 11:33:40.0

Outline of PNC Inc's BGA assembly capabilities.

PNC Inc.

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Indium Corporation’s Low-Voiding Solder Pastes Featured at IPC APEX 2016

Industry News | 2016-03-17 14:15:35.0

Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.

Indium Corporation

Indium Corporation to Feature Low-Voiding Solder Paste at IPC APEX 2016

Industry News | 2016-02-06 01:03:23.0

Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.

Indium Corporation

Improve board level reliability by reducing solder joint voiding below 10%

Industry News | 2023-11-20 13:47:24.0

MacDermid Alpha Electronics Solutions launches ALPHA® OM-362, its latest next-generation low-void solder paste.

MacDermid Alpha Electronics Solutions

SHENMAO's PF606-P276 Ultra-Low Void Paste Ensures High Joint Strength

Industry News | 2024-05-13 10:19:11.0

SHENMAO Technology is pleased to offer its PF606-P276 Ultra-Low Void No-Clean Zero-Halogen Lead-Free Solder Paste. PF606-P276 has been specifically developed for the surface mount technology (SMT) process, offering superior void performance after the reflow process. By minimizing gas generation during reflow, this solder paste ensures exceptional reliability and performance for a wide range of electronic components and assemblies.

Shenmao Technology Inc.


bga void specification ipc searches for Companies, Equipment, Machines, Suppliers & Information

Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Training Provider / Events Organizer / Association / Non-Profit

3000 Lakeside Drive, 309 S
Bannockburn, IL USA

Phone: 847-615-7100

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