Industry News: bga warped pcb (Page 16 of 64)

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Koh Young Intros New Platform KY8030-3 SPI at SMTAI

Industry News | 2013-09-10 13:21:08.0

Koh Young will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136

Koh Young America, Inc.

Package Converters Enable Testing Generation I product on Generation II System

Industry News | 2010-11-30 13:30:04.0

Ironwood Electronics' new package converter - PC-BGA256B/BGA256E-B-01 allow previous product version to be used in the new system boards for test/validation until the new BGA device is released from the foundry or vice versa. These package converters can be soldered directly onto the SMT pads of development boards using standard solder methods.

Ironwood Electronics

Prototype and Debug 96 ball BGA with Ease

Industry News | 2011-02-14 16:05:28.0

Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.

Ironwood Electronics

Stamped Spring Pin BGA Socket for IDT's FCBGA144

Industry News | 2011-03-22 16:23:31.0

Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for BGA devices - CBT-BGA-6014.

Ironwood Electronics

Seika Announces New Options and Features for SAYAKA PCB Routers

Industry News | 2023-02-06 14:18:59.0

Seika Machinery, Inc. is pleased to announce new options and features available for stock SAYAKA PCB routers. SAYAKA routers are capable of MES connection and support customers with achieving optimized production control within the scope of Industry 4.0.

Seika Machinery, Inc.

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Industry News | 2018-10-18 08:59:34.0

PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)

Flason Electronic Co.,limited

New SAYAKA PCB Router SAM-CT34XJ Stand Alone & Inline Solution from Seika Machinery

Industry News | 2021-04-06 12:36:39.0

Seika Machinery, Inc. introduces the SAYAKA PCB Router SAM-CT34XJ Stand Alone & In-Line Solution. The standalone and in-line solution works as an in-line and off-line router.

Seika Machinery, Inc.

8 GHz Bandwidth Socket for Intel's ICH6 (I/O Controller Hub 6) BGA Package

Industry News | 2011-04-06 14:07:24.0

Ironwood Electronics has recently introduced a new high performance BGA socket for 1.118mm pitch, 729 pin BGA IC's. The SG-BGA-6345 socket is designed for 31X31 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss.

Ironwood Electronics

SIPLACE Smart Pin Support: Set Support Pins Automatically and Reliably

Industry News | 2012-09-20 14:20:40.0

More and more often electronics manufacturers have to deal with large, heavy or very thin boards which frequently require support pins for the placement process in order to prevent warping or vibrations. With its SIPLACE Smart Pin Support, ASM Assembly Systems provides a hardware-software combination that simplifies this previously cumbersome and complex support pin placement process for all boards.

ASM Assembly Systems GmbH & Co. KG


bga warped pcb searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830