Industry News | 2015-09-30 16:50:32.0
MIRTEC and YXLON were awarded Best Innovation by SMT Today Magazine for the joint development of the SmartLoop yield improvement system during the recent SMTA International Conference & Exhibition. The award was presented to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division, and Keith Bryant, Sales Director for SmartLoop, on Tuesday, September 29, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The ‘Best Innovation Award’ recognizes clear visionary and transformative technology within the electronics manufacturing industry. This award showcases innovations that have not only addressed a need and solved a problem, but have also been used to drive improved efficiency and productivity of an organization.
Industry News | 2015-11-12 20:58:32.0
MIRTEC and YXLON jointly received a 2015 Global Technology Award in the category of Software – Production for the new SmartLoop yield improvement system. The award was presented to the companies during a ceremony on Tuesday, Nov. 10, 2015 that took place at the Messe München exhibition center in Munich, Germany during Productronica.
Industry News | 2003-06-04 09:19:23.0
With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.
Industry News | 2003-06-25 12:40:26.0
to manufacture and market printed circuit boards utilizing PCB Channel Routing technology from Nortel Networks
Industry News | 2018-08-21 20:05:28.0
MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.
Industry News | 2007-01-29 15:10:05.0
Palo Alto, Calif.
Industry News | 2015-05-07 19:28:29.0
MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.
Industry News | 2013-01-30 17:54:43.0
Design, assembly, inspection and repair personnel have a new tool to help improve reliability of ball grid arrays (BGAs) and fine-pitch ball grid arrays (FBGAs) in high density applications, thanks to the newly released C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2013-02-05 14:13:33.0
BGA Rework System Demo Tour
