Industry News | 2006-04-17 11:14:44.0
Indium Corporation�s NF260 No-Flow Underfill was awarded the 2006 EM Asia
Industry News | 2020-11-24 15:18:53.0
Viscom's proven S3088 CCI inspection system ensures high-precision conformal coating inspection of printed circuit boards. The system quickly and reliably detects typical defects such as cracks, coating voids, smearing and splashing. Layer thickness and wet coating can also be analyzed. The S3088 CCI now comes standard with an unmatched upper transport clearance of 105 mm, thus providing even more flexibility during final inspection of fully assembled components.
Industry News | 2014-08-26 16:50:47.0
Viscom announced today that it will exhibit in Booth #434 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2019-05-31 08:50:57.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2019-05-31 08:56:07.0
Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis
Industry News | 2012-04-10 14:47:49.0
The Balver Zinn/Cobar Group announces that its SN100C Wire Solder and Cobrush flux applicator were demonstrated at the first Hand Solder Competition at the recently held IPC APEX EXPO in San Diego.
Industry News | 2014-02-20 14:47:22.0
Viscom announced today that it will present the most advanced and comprehensive SPI, AOI and X-ray portfolio on the market in Booth #524 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
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