Industry News: bio (Page 10 of 12)

FINEPLACER® matrix – "The new generation" World premiere at Productronica in Munich

Industry News | 2009-12-07 18:52:26.0

With the FINEPLACER® matrix, Finetech is not only extending its product range, but also pointing the way forward for the product family. The modular thinking behind the FINEPLACER ®s has been further perfected. Depending on the customer's requirements, the platform can be configured either as a high-end rework system or as a high-precision assembly and bonding system. In each case there are two accuracy options available, of 10 µm and 3 µm.

Finetech

DIVSYS International Busy at APEX 2011

Industry News | 2011-03-16 11:36:35.0

DIVSYS International, LLC folks will be busy at the IPC APEX show in Las Vegas this year. DIVSYS has developed an excellent relationship with GM Components Holdings, LLC (GMCH), a potential source of production for ceramic boards and thick film hybrids. DIVSYS will also be competing for the 2011 Circuits Assembly Service Excellence Award that will be announced on the first evening of the show, and Tammie Fish speaking at the Women in Electronics Breakfast!

DIVSYS International-ICAPE, LLC

DIVSYS International, LLC Busy at APEX 2011

Industry News | 2011-03-22 14:54:08.0

DIVSYS International, LLC folks will be busy at the IPC APEX show in Las Vegas this year. DIVSYS has developed an excellent relationship with GM Components Holdings, LLC (GMCH), a potential source of production for ceramic boards and thick film hybrids. DIVSYS will also be competing for the 2011 Circuits Assembly Service Excellence Award that will be announced on the first evening of the show, and Tammie Fish speaking at the Women in Electronics Breakfast!

DIVSYS International-ICAPE, LLC

Finetech to Exhibit at NEPCON China 2011

Industry News | 2011-04-20 16:31:45.0

Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.

Finetech

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

HITACHI Solder Paste Printers, Koh Young SPI Systems Interface for ‘On-the-fly’ Print Process Optimization

Industry News | 2012-12-07 13:52:19.0

Hitachi high-speed, high performance solder paste printers and Koh Young Technology's 3D Solder Paste Inspection (SPI) systems can now "talk" to one another via Koh Young's award-winning Closed Loop Interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them at the printer.

Hitachi High Technologies America, Inc.

Hitachi HTI Introduces SL Feeder with Automatic Tape Loading

Industry News | 2013-02-08 17:27:30.0

The Production Systems Division (PSD) of Hitachi High Technologies America, Inc. (HTA) announces the introduction of the first true innovation in the SMT component placement market in years with the industry's first automatic self-loading feeder, the SL. The 8mm SL Feeder provides splice-free continuous operation and resolves issues that have plagued electronics assembly customers for years caused by component reel splicing, including improperly spliced tape that interrupts production, and higher material and labor costs.

Hitachi High Technologies America, Inc.

ADLINK CoreModule® 920 with 3rd Generation Intel® Core™ Processor Delivering Highest Performance at Low Power

Industry News | 2013-03-13 13:36:45.0

ADLINK Technology releases its newest Extreme Rugged™ CoreModule® offering. The ADLINK CoreModule® 920, with outstanding mechanical, thermal and power design, is able to support Intel® Core™ i7 performance with low power consumption in a small PC/104 form factor, making it an ideal choice for mission-critical applications in space-constrained environments such as transportation, aviation and defense/homeland security.

ADLINK Technology, Inc.

ADLINK Announces Compact COM Express® Type 6 Module Featuring High Performance and Ultra-Low Power Consumption

Industry News | 2014-02-20 20:04:17.0

Embedded systems in the areas of medical, digital signage, gaming, video conferencing and industrial automation need outstanding CPU and graphics performance but are constrained by either size or thermal management. ADLINK Technology's new offering, the cExpress-HL COM Express® Type 6 Compact size computer-on-module (COM), takes full advantage of the Mobile 4th Generation Intel® Core™ Processor (formerly known as "Haswell-ULT") to provide a compact, high-performance COM solution with outstanding graphics capabilities.

ADLINK Technology, Inc.

ADLINK Introduces Feature-Rich COM Express® Module with 4th Generation Intel® Core™ Processor

Industry News | 2014-04-01 19:35:47.0

ADLINK Technology rolled out its most advanced COM Express® Type 6 module, adopting the 4th generation Intel® Core™ processor (formerly codenamed Haswell) and delivering breakthrough CPU performance, stunning graphics, and improved security functions. The ADLINK Express-HL is among the first products in an array of industrial embedded systems delivering the computing power of Intel’s newest generation Core processor family.

ADLINK Technology, Inc.


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