Industry News: black box (Page 1 of 3)

Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

SMTnet

SMTA Attends Summit in Support of Industry Workforce Development

Industry News | 2022-08-29 15:06:06.0

SMTA members and staff were among the 50 carefully-selected invitees who participated in the Future Electronics Workforce (F.E.W.) Summit held at Michigan Technological University (MTU) on August 17, 2022. Co-sponsored by Calumet Electronics and Michigan Technological University, and supported by the US Department of Defense (DoD) Industrial Base Analysis and Sustainment (IBAS) program, the summit had the goal of generating and implementing specific actions for each of the major stakeholder groups present that could ease the potentially crippling shortage of replacement technical staff in defense-critical electronics manufacturing.

Surface Mount Technology Association (SMTA)

ViTrox and KIC Establish Cooperation and Connectivity

Industry News | 2017-08-16 17:48:42.0

KIC today announced a new business relationship with ViTrox Corporation. ViTrox, the leader in visual inspection and production line dashboard systems, and KIC, the smart oven technology company, have established this new business relationship to meet the needs of the evolving electronics industry. The need for real-time data and insight from production machines and inspection systems is growing rapidly as the electronic manufacturing industry converts factories into smart production facilities. While real-time dashboard and traceability systems have been around for some time, the ‘black box’ reflow process has been a glaring omission in such systems. The ViTrox V-One system will connect to KIC’s automatic profiling and thermal monitoring systems to offer a full line solution.

KIC Thermal

KIC and iTAC Software AG Integrate Smart Reflow Process Data in the MES i4.0 Solution

Industry News | 2019-01-17 20:29:01.0

KIC announces its partnership with iTAC Software AG, a leading Provider of MES premium solutions. The integration of smart Reflow Process Inspection (RPI) data analytics into the iTAC.MES.Suite ensures complete process control and traceability of the thermal process in the oven, previously referred to as the “black box” machine in the production line. This KIC-iTAC partnership creates new customer value for not only the reflow process, but for the entire production line, by providing process transparency, traceability, consistent quality and reduced costs through a new level of connectivity and automation. With the connection to KIC’s RPI data analytics iTAC now provides real-time insight into the reflow process to help factories run their production more effectively by reducing setup and changeover time, faster yield troubleshooting, and reduction in scrap and rework.

KIC Thermal

Thermal Process Yield Data Coming to a PC Near You

Industry News | 2008-08-26 15:28:12.0

San Diego � August 26, 2008 � KIC, the leader of thermal process development and control products, and winner of multiple industry awards, announces a new standard feature with its KIC 24/7 Thermal Management System. The new feature focuses on the fundamental responsibility of a reflow oven � to produce each and every product in spec.

KIC Thermal

KIC to Highlight Thermal Process Yield Data Feature at IPC Midwest 2008

Industry News | 2008-09-12 03:37:05.0

KIC will showcase the newest standard feature of its KIC 24/7 Thermal Management System in booth 301 at the IPC Midwest Conference & Exhibition.

KIC Thermal

KIC Releases a Reflow Quality Inspection System

Industry News | 2012-01-10 19:58:20.0

KIC announces the release of the Reflow Process Index (RPI), designed to help electronics manufacturers receive maximum quality and throughput from their reflow ovens.

KIC Thermal

Richard Clark of Morgan Advanced Materials selected to speak on microporous insulation at MS&T15 Thermal Protection Materials and Systems symposium

Industry News | 2015-09-25 14:50:41.0

Morgan Advanced Materials announces that strategic business development specialist Richard Clark will be presenting “The Unparalleled Advantages of Microporous Insulation” at the upcoming Materials Science and Technology 2015 (MS&T15) conference. His presentation, part of the Thermal Protection Materials and Systems symposium, will take place October 6, 2015 at 3:00 p.m. in the Greater Columbus Convention Center, Room E160A.

Morgan Advanced Materials

BPM Introduces BPWin Version 5.0

Industry News | 2009-06-26 17:15:18.0

HOUSTON — June 2009 — BPM introduces BPWin 5.0, a culmination of new and recent improvements in efficiency, productivity, intellectual property protection and process management.

BPM Microsystems, Inc.

KIC’s MB Allen to Discuss Smart Reflow Ovens for the Industry 4.0 Factory

Industry News | 2017-10-08 17:47:17.0

KIC announces that MB (Marybeth) Allen will present at the SMTA New England Expo & Tech Forum, scheduled to take place Thursday, Nov. 16, 2017 at the DCU Center in Worcester, MA. Allen will present, “The Smart Reflow Oven for the Industry 4.0 factory.”

KIC Thermal

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