Industry News | 2014-04-30 13:42:31.0
Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.
Industry News | 2014-07-09 10:22:05.0
Indium Corporation recently released RMA-155 Pb-Free Solder Paste. RMA-155 is the best solder paste for customers who are required to use RMA materials, but who need the performance benefits of modern Pb-free solder paste technology.
Industry News | 2015-11-12 12:08:30.0
Indium Corporation presented its suite of void-reducing solder pastes, including halogen-free, no-clean Indium8.9HF, at Productronica 2015, Nov. 10-13, in Munich, Germany.
Industry News | 2016-02-06 01:03:23.0
Indium Corporation will feature its void-reducing no-clean solder pastes to help customers Avoid the Void™ at IPC APEX Expo.
Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2016-03-17 14:15:35.0
Manufacturers no longer have to settle for unacceptable levels of voiding when soldering QFNs, CSPs, or BGAs. Indium Corporation will help customers Avoid the Void™ with its void-reducing no-clean solder pastes at IPC APEX Expo.
Industry News | 2014-02-20 10:36:06.0
ViTrox Technologies will debut the new V510 Optimus 3D AOI system in booth #717 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.
Industry News | 2015-01-19 20:59:27.0
FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.
Industry News | 2020-07-16 12:28:05.0
A quick determination of a stencil wiping roll's ability to withstand fiber detachment and consequent contamination of circuit boards during the printing process
Industry News | 2009-02-15 20:20:27.0
Indium Corporation's Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference, Transitioning to Lead Free � Strategies for Implementation, in Santa Clara, California, March 3-5, 2009. Both Mario and Ed are based at Indium's global headquarters in Clinton, NY.
