Industry News: black pad defect (Page 8 of 20)

SMT Stencil Cleaning Roll Tape Test

Industry News | 2020-07-16 12:28:05.0

A quick determination of a stencil wiping roll's ability to withstand fiber detachment and consequent contamination of circuit boards during the printing process

High-Tech Conversions

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Industry News | 2018-10-18 08:21:10.0

How to Prevent Non-Wetting Defect during the SMT Reflow Process

Flason Electronic Co.,limited

CyberOptics to Display SE 300 Ultra� 3-D Solder Paste Inspection at Productronica 2007

Industry News | 2007-11-01 02:12:55.0

MINNEAPOLIS - October 31, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will feature SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth A4.262 with GPS Technologies at the upcoming Productronica 2007 exhibition and conference scheduled to take place November 13-16, 2007 at the New Munich Trade Fair Center in Munich, Germany.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at APEX 2008

Industry News | 2008-03-14 19:37:03.0

MINNEAPOLIS - March 2008 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in booth 2215 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at Nepcon Shanghai 2008

Industry News | 2008-04-07 21:53:22.0

MINNEAPOLIS - December 20, 2007 - CyberOptics Corporation (Nasdaq: CYBE) announced that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in the West Hall L1, booth 1A26 - at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.

CyberOptics Corporation

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at ExpoElectronica in Moscow.

Industry News | 2008-04-08 23:15:05.0

MINNEAPOLIS - April 2008 - CyberOptics Corporation (Nasdaq: CYBE) announces that it will exhibit SE 300 Ultra, its industry-leading 100 percent 3-D solder paste inspection system, in distributor AssemRus booth number 13 Hall 104 at the upcoming ExpoElectronica exhibition and conference, scheduled to take place April 15-18, 2008 at the Crocus Expo, Moscow.

CyberOptics Corporation

Indium Corporation Technical Engineers' Papers Accepted by IPC Lead-Free Conference

Industry News | 2009-02-15 20:20:27.0

Indium Corporation's Senior Technical Support Engineer Mario Scalzo and Technical Support Engineer Ed Briggs had their papers accepted for presentation at the IPC/JEDEC Conference, Transitioning to Lead Free � Strategies for Implementation, in Santa Clara, California, March 3-5, 2009. Both Mario and Ed are based at Indium's global headquarters in Clinton, NY.

Indium Corporation

Japan Unix Can Reduce PCB Burning Issues with Optimal Laser Shape Rings

Industry News | 2015-06-02 13:26:13.0

Japan Unix introduces laser shape rings. Choosing the best laser spot shape to fit components and land shapes can reduce circuit board problems.

Japan Unix Co., Ltd.

High Temperature & Ultra Small Passive Component Design Technology Webinars

Industry News | 2015-02-22 06:49:16.0

We would like to invite you to two free technology webinars based on projects run with the support of NPL. These free webinars will be presented by Dennis Price, Quality Director Merlin Circuit Technology & Bob Willis, NPL Defect Database Coordinator. The webinars focus on PCB and assembly technology for High Temperature Electronics and Small Passive Components for Modern Electronics. All you need to do is follow the links to register online free

ASKbobwillis.com

Precision Traceability Is a Growing Need in SMT Manufacturing

Industry News | 2010-05-11 13:55:50.0

RENTON, WA, — Industry leaders Microscan and Juki Automation Systems met at the recent IPC/APEX Expo held in early April in Las Vegas to demonstrate their latest technologies for electronics manufacturers and to discuss the growing demand for complete traceability and importance of reliable machine vision systems throughout the SMT environment. Juki recently integrated Microscan's Visionscape® machine vision software into the JX-100 placement system.

Microscan


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