Industry News: black pad defect (Page 10 of 20)

Kodiak Assembly Offers 01005 Ultra-Compact Package Assembly

Industry News | 2019-09-30 15:16:14.0

Kodiak Assembly Solutions LP, a leading contract electronic manufacturer, is pleased to announce its entry into 01005 Ultra-Compact Package Assembly.

Kodiak Assembly Solutions

CableEye® Micro-Match™ Connector Board, CB49

Industry News | 2016-03-09 11:23:40.0

CAMI Research Inc. (Acton, MA) announces a new board for its CableEye cable and harness testing systems. Populated with solder pads to accept a suite of TE-Connectivity™ Micro-MaTch connectors, the board addresses markets plagued by vibration and fretting corrosion, and requiring “miniaturized connectivity”. Rated to 500Vdc/350Vac, the CB49 may be used on all CableEye models.

CAMI Research Inc.

CableEye® Generic Surface Mount & TH Board, CB51

Industry News | 2016-10-11 13:26:07.0

CAMI Research Inc. (Acton, MA) announces another new board for its CableEye cable and harness testing systems. Populated with solder pads to accept both aligned and staggered, 1.25mm and 1.5mm pitch, surface mount and through hole (TH) connectors, the board addresses any market with a demand for board-to-board connections. Rated to 700Vdc/500Vac, the CB51 may be used on all CableEye models.

CAMI Research Inc.

Nihon Superior to Premier New SN100C Products at APEX 2009

Industry News | 2009-03-10 16:11:29.0

OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that it will showcase a new, expanded range of SN100C products in booth 2564 at the upcoming APEX exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.

Nihon Superior Co., Ltd.

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:00:40.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

SMT solder joint quality and appearance inspection process

Industry News | 2018-10-18 08:01:00.0

SMT solder joint quality and appearance inspection process

Flason Electronic Co.,limited

Viscom’s S3088 SPI inspection system wins Global Technology Award

Industry News | 2017-11-15 20:21:17.0

Viscom announces that it was awarded a 2017 Global Technology Award in the category of Inspection – SPI. The award was presented to the company during a ceremony on Tuesday, Nov. 14, 2017 that took place during productronica in Munich, Germany.

Viscom AG

Viscom Enables Greater CCI Inspection Range with HighDensity Module

Industry News | 2016-09-29 20:38:06.0

Viscom now offers a HighDensity module in addition to standard camera equipment for inspecting conformal coatings in electronics production. This is the better choice, particularly where silicone or especially thin coatings need to be reliably inspected. The new HighDensity module will be on display in Stand A1.217 at electronica, scheduled to take place Nov. 8-11, 2016 at the Messe München.

Viscom AG

CyberOptics to Exhibit New AOI Tabletop System, Successful In-line Inspection Solutions at Electronica/Productronica India 2011

Industry News | 2011-09-06 13:55:56.0

CyberOptics Corporation will display a prototype version of the new QX100™ AOI Tabletop System alongside its latest inspection technologies at the upcoming Electronica International Trade Fair.

CyberOptics Corporation

ASC International Partners with the NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-22 20:41:43.0

ASC International today announced that its VisionPro HSi will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

ASC International


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