Industry News | 2015-04-02 10:50:04.0
Speedprint Technology announces its participation in the upcoming PCB Assembly & Manufacturing Technology Workshop hosted by Kintner Equipment Corporation on April 21-23 in Endicott, NY. Speedprint Technology is proud to be co-hosting what promises to be one of the most informative events in the northeast for manufacturing, process and quality engineers involved in printed circuit board assembly (PCBA) processes.
Industry News | 2017-08-15 20:47:04.0
BTU International will exhibit in Booth #430 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. BTU will showcase new technology to support Industry 4.0 during the two-day exhibition.
Industry News | 2010-11-17 13:30:51.0
Indium Corporation announces that Chris Nash has been promoted to Senior Technical Support Engineer. He is based at Indium’s global headquarters in Clinton, NY.
Industry News | 2013-08-26 20:41:26.0
ACD announces that it has passed its ISO 13485 recertification. Additionally, the company has upgraded to ISO 13485:2012 Medical Devices, Quality Management Systems, and Requirements for Regulatory Purposes.
Industry News | 2016-04-04 11:45:09.0
Conecsus announces the appointment of 15-year veteran Laurie Debord to the position of Contract Administrations Manager. Conecsus, LLC processes wastes containing primarily Tin, Tin-Zinc, Lead, Silver, Gold, and Copper, and converts them into usable metal products for sale into the global market.
Industry News | 2011-08-24 13:12:43.0
Indium Corporation experts will present technical findings at IPC Midwest Conference & Exhibition
Industry News | 2011-12-30 23:20:54.0
SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will host a workshop titled Handling Moisture-Sensitive Components & PCBs Without Failure on Wednesday, January 25, 2012 at the Stoke Mandeville Stadium in Aylesbury, Buckinghamshire, UK.
Industry News | 2018-05-09 20:32:24.0
KYZEN announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared in Hall 4A, Stand 536, June 5-7, 2018 at the Messe in Nuremberg, Germany. The introduction video can be viewed here: www.KYZEN-SneakPeek.com
Industry News | 2024-02-19 11:47:54.0
As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.
Industry News | 2013-07-17 14:39:58.0
Ryder Industries Ltd., a professional EMS provider, announces plans to add an extension to its Coastal I factory in Shenzhen, a coastal city bordering Hong Kong.
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