Industry News: bn* (Page 1 of 2)

Seika Machinery Introduces McDry HM-1002BN Nitrogen Auto-Flow Cabinet

Industry News | 2015-03-18 20:53:12.0

Seika Machinery introduces the new McDry HM-1002BN Nitrogen Auto-Flow Cabinet.

Seika Machinery, Inc.

ELCINA PARTNERS WITH COMPONEX NEPCON � Redefining Excellence in the local electronics industry

Industry News | 2008-11-24 20:43:05.0

ELCINA Electronic Industries Association of India, the premier industry body, enters into an exclusive tie-up with Reed Exhibitions India, the organisers of COMPONEX NEPCON, with a three-year agreement to support the electronic components, materials and production equipment business-to-business exhibition. ELCINA has remained committed to the promotion of the electronics manufacturing culture by focusing on components � the building blocks of electronics industry.

Reed Exhibitions

Top 10 Consumer Electronics Companies in the World

Industry News | 2018-12-08 03:35:10.0

Top 10 Consumer Electronics Companies in the World

Flason Electronic Co.,limited

NEPCON China 2011 to Highlight Trends in Intelligent Auto Electronics Manufacturing

Industry News | 2011-01-12 14:09:46.0

At the recently held Expo 2010 Shanghai, the 10-minute film “2030 Go!”, shown in the SAIC-GM Pavilion, showed intelligent technologies that included “car networking” and “unmanned car-driving” ― features of futuristic cars expected by the year 2030. Although vehicles that feature concepts like car networking are not yet popular in the mainstream, the application of electronic information technology in vehicles has long been standard.

Reed Exhibitions

Japan Unix Can Reduce PCB Burning Issues with Optimal Laser Shape Rings

Industry News | 2015-06-02 13:26:13.0

Japan Unix introduces laser shape rings. Choosing the best laser spot shape to fit components and land shapes can reduce circuit board problems.

Japan Unix Co., Ltd.

ATE China 2010 Set to Reenergize Growth of Electronics Assembly and Packaging Industry

Industry News | 2010-08-10 14:16:50.0

The Electronics Assembly and Packaging Technology Expo 2010 (ATE China 2010) will take place between August 31 and September 2 at the Shenzhen Convention & Exhibition Center. The expo will highlight various types of electronics assembly and packaging facilities, both locally and abroad. It also will offer technical solutions to assembly and production problems and allow buyers to identify new suppliers ― all of which will enhance competitiveness in the industry.

Reed Exhibitions

Shining a Spotlight on the Industry’s Key Issues

Industry News | 2010-08-10 15:01:40.0

Numerous industry-related conferences to be held at NEPCON South China

Reed Exhibitions

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