Industry News | 2009-12-17 18:14:12.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."
Industry News | 2022-12-07 07:48:52.0
With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2024-02-12 13:44:30.0
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2012-03-07 19:42:26.0
IPC bestowed its highest corporate honors to DDi Corp. and Flextronics. During luncheons held in conjunction with IPC APEX EXPO®, IPC awarded the IPC Peter Sarmanian Corporate Recognition Award to DDi Corp. and the IPC Stan Plzak Corporate Recognition Award to Flextronics. For many years, both DDi Corp. and Flextronics have consistently provided staff resources to standards development and other committee initiatives.
Industry News | 2012-03-28 17:53:21.0
IPC announces the appointment of John W. Mitchell as its new president and CEO,
Industry News | 2013-10-01 18:16:06.0
A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.
Industry News | 2011-10-08 17:54:35.0
IPC is seeking an outstanding individual to become its next president and chief executive officer (CEO). The candidate will succeed current CEO Denny McGuirk, who leaves on November 3 to become president of SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains.
Industry News | 2022-03-14 08:04:11.0
In recognition and acknowledgment of their extraordinary contributions to the Wiring Harness Manufacturer's Association (WHMA) and the cable and wire harness industry, four long-time WHMA members were presented with coveted WHMA awards. Two WHMA Hall of Fame and two WHMA Volunteer Excellence Awards were presented at WHMA's 29th Annual Wire Harness Conference on February 16.
