Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2009-12-07 18:40:41.0
Europlacer, a designer and manufacturer of comprehensive SMT placement systems for the global electronics industry, announces that it will debut its XPii modular pick-and-place system in Hall A2, Stand 439 of the upcoming Productronica exhibition, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2012-01-05 19:20:11.0
Multitest announces that its UltraFlat™ process meets the requirements of high parallel vertical probe card applications.
Industry News | 2015-02-17 10:54:42.0
Seica will be exhibiting our new line of flying prober, the Pilot 4D line which will be represented at the show by the Pilot 4DV8 and Pilot FX. The Pilot 4D line represents the latest in technology in flying probe testing for both ICT, functional testing and data regeneration applications.
Industry News | 2014-12-29 06:28:26.0
Seica Inc. will be exhibiting our new line of flying prober, the Pilot 4D line which will be represented at the show by the Pilot 4DV8 and Pilot FX. The Pilot 4D line represents the latest in technology in flying probe testing for both ICT, functional testing and data regeneration applications.
Industry News | 2018-10-18 11:21:46.0
Designing a Multilayer PCB Layout
Industry News | 2021-05-31 03:45:39.0
PILOT V8 XL NEXT, THE FLYING PROBER TO ACCOMMODATE BOARDS WITH BIG DIMENSION
Industry News | 2012-03-07 18:15:11.0
Multitest recently launched the newest member of the Quad Tech™ contactor family: the Triton™ contactor for high-end digital applications.
Industry News | 2014-05-14 17:36:38.0
BTU International, Inc. , will highlight the company’s new Stacked Wafer Inline Furnace Technology (SWIFT), ultra-high throughput technology for solar cell diffusion, in booth E3-210 at the 8th SNEC Power Expo 2014, scheduled to take place May 20-22, 2014, at the Shanghai New International Expo Center in Shanghai, China.
Industry News | 2016-10-09 20:54:35.0
The Blakell Europlacer Distribution team hosted a User Group Day at the company’s UK headquarters in Dorset recently. The focus of the event was ‘Traceability’ and attracted over fifty participants. All were interested in seeing how the latest products and support initiatives from Europlacer’s distribution arm manage traceability that can be integrated to deliver line-wide traceability solutions.
