Industry News: board error correction assembly (Page 33 of 56)

Gen3 Launches New Objective Evidence Site during APEX

Industry News | 2023-02-06 14:16:30.0

Gen3 is pleased to announce that it released its new Objective Evidence website during the 2023 IPC APEX EXPO.

Gen3 Systems

Saki Corporation Collaborates with Ersa to Demonstrate Benefits of 2D Bottom-side AOI for Inspection after Selective Soldering

Industry News | 2019-08-28 00:00:21.0

Saki Corporation will exhibit its 2Di-LU1 2D bottom-side automated optical inspection (AOI) system at NEPCON Asia along with its 3D AOI and solder paste inspection (SPI) systems and M2M capabilities for ensuring defect-free electronics for automotive and mobile applications. To demonstrate the speed and effectiveness of its 2D bottom-side AOI, Saki is collaborating with Ersa, Wertheim, Germany, to inspect the bottom-side of a printed circuit board assembly (PCBA) after Ersa's SMARTFLOW 2020 selective soldering process.

SAKI America

Automated Circuit Design (ACD) Selects Optel for Complete Process Traceability

Industry News | 2008-10-07 23:21:42.0

Optimal Electronics Corporation announces that ACD, a leading supplier to the electronics industry based in Richardson, Texas, has selected Optel for its lean manufacturing process traceability solution.

Optimal Electronics Corporation

DEK�s Award-Winning HawkEye Inspection System on Display at Nepcon East

Industry News | 2006-04-24 15:56:46.0

One need only see a quick demonstration of DEK�s new HawkEye� post-print verification technology to understand why it continues to gain widespread acceptance and win global industry accolades. Visitors to the DEK booth at Nepcon East this year will have such an opportunity.

ASM Assembly Systems (DEK)

Essemtec Introduces Semiautomatic Printer with Vision and Stencil Cleaning

Industry News | 2008-08-12 00:49:23.0

The new SP150 screen/stencil printer from Essemtec fulfils the long-term demands of many small and medium size enterprises: A semiautomatic system with integrated stencil cleaning, controlled printing process and digital vision system. This affordable machine can reproducibly print the finest structures even in larger series. Because of the space saving front drawer, the SP150 fits into every production.

ESSEMTEC AG

Nordson to Feature Test and Inspection Systems in the SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience at SMTAI

Industry News | 2015-09-14 17:31:42.0

Nordson DAGE and Nordson YESTECH, divisions of Nordson Corporation are pleased to announce that their products will be featured in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience from Sept. 29-30, 2015 on the show floor of SMTAI. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

Nordson DAGE

PANASONIC AND ASSEMBLY PRODUCTS DELIVER HIGH-MIX SOLUTIONS TO EASTERN US ELECTRONICS ASSEMBLY MARKET

Industry News | 2011-08-30 13:02:30.0

Panasonic Factory Solutions Company of America (PFSA) and Assembly Products, Inc. collaborated to deliver high-mix solutions to the Eastern US electronics assembly market in response to elevated interest in the NPM-W placement machine and PanaCIM® Enterprise Edition Manufacturing Execution System (MES).

Panasonic Factory Solutions Company of America (PFSA)

New Low Cost Breakout Boards Accelerate PLD Design and Hardware Evaluation

Industry News | 2011-03-28 11:42:40.0

Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of three new low cost I/O Breakout Boards: the MachXO™ 2280 Breakout Board, the ispMACH® 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board.

Lattice Semiconductor

TAKAYA Launches APT-1600FD-SL, Dual-Sided Flying Probe Tester with Big Board Handling Capability, Advanced Features

Industry News | 2021-06-30 04:21:06.0

Takaya's APT-1600FD-SL Dual Sided Flying Probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (Battery Management System) applications. The "-SL" series provides a 48% larger test area, which aligns perfectly with applications including semi conductor test probe card manufacturers. These customers urged Takaya to increase the test area of their dual-sided system.

Texmac, Inc.


board error correction assembly searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

Manufacturer

18220 Butterfield Blvd
Morgan Hill, CA USA

Phone: 5102268155

Solder Paste Dispensing

High Resolution Fast Speed Industrial Cameras.
Sell Used SMT & Test Equipment

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications


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