Industry News | 2011-06-20 19:55:16.0
IPC Midwest Conference & Exhibition will be held September 21–22, 2011, at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, Ill. After being a co-located event in Rosemont in 2010, IPC Midwest will be produced solely by IPC in 2011 and will bring focused, targeted and relevant information for the electronics manufacturing and printed boards industries.
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2015-08-20 13:42:15.0
IPC — Association Connecting Electronics Industries® has released IPC-4101D-WAM1, an amendment to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards. This newly revised standard delivers trending information for base materials used for rigid and multilayer printed boards.
Industry News | 2010-08-31 12:11:44.0
Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Electronics Assembly Quality & Reliability Conference in Budapest, Hungary on 6–7 October, 2010.
Industry News | 2019-09-11 14:47:58.0
The IPC Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing for board fabrication, assembly and post-assembly protection. The three-day forum, to be held November 5-7 in Bloomington, Minn. will be co-located with a Pb-free Electronics Risk Management (PERM) Council meeting.
Industry News | 2024-01-08 12:55:23.0
Registration now open for virtual preliminary heat
Industry News | 2018-07-10 20:52:09.0
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
Industry News | 2001-10-26 07:40:19.0
IPC has elected new officers.
Industry News | 2020-04-14 22:07:07.0
ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.
Industry News | 2014-01-08 18:09:35.0
Congresswoman Kyrsten Sinema (AZ-9) visited Isola's manufacturing and R&D facilities in Chandler, Arizona on Friday, January 3 to learn about the issues that concern the developer and manufacturer of materials used to fabricate advanced printed circuit boards.
