Industry News | 2018-10-18 10:49:25.0
Panelizing PCBs with Tab Routing
Industry News | 2020-07-01 12:08:16.0
For high precision low stress PCB singulation of panels with sensitive components near the parting edge, and with the smooth edge finish required by military specifications or by packaging considerations, using a Diamond Blade Saw beats routing for speed and for blade life. The saw blade, a 2.95" (75mm) diameter .021" thick diamond coated cutting disk, provides a low-stress, ultra smooth edge finish for separting panelized Printed Circuit Cards. ts which overhang the parting line will remain intact.
Industry News | 2017-01-25 16:39:34.0
Singulating tab routed printed circuit cards in low to medium volume production quantities is safe and easy with the N100 Nibbler from FKN Systek. Blades are available in standard thicknesses of .120”, .093” and .062”. Custom sizes to match the width of the routed section can be ground. Tabs are cut cleanly on each side so that no further clean up is required to remove excess material, as is often the case when using hand tools or when breaking the panels manually. In addition, since only one tab is cut at a time, minimal stress is imparted to the board during the process as the panel is not pressed between two points during the cut.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2019-09-06 14:46:04.0
THREE BLADE CHOICES FOR SINGULATING RECTANGULAR TAB ROUTED PCBS CLEANLY SINGULATE STANDARD AND FLEX CIRCUIT PANELS WITHOUT DUST Cleanly
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
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