Industry News: board support pin (Page 6 of 492)

Digitaltest Announces New High-Speed Test Heads For MTS 500 Condor Flying Probe Test System

Industry News | 2003-06-19 08:13:11.0

The new heads are capable of reaching an acceleration of greater than 20g.

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Water-Based Flux Line Covers Full Range of Applications

Industry News | 2003-02-17 08:40:25.0

To Meet Government Environmental Standards and Individual Company Policies, While Satisfying Production Requirements

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GPS Antenna Shrinks to Surface Mounting

Industry News | 2003-03-14 09:03:48.0

Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.

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University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

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CirTran Receives Joint U.S./Canadian Certification

Industry News | 2003-02-25 08:07:11.0

Announced that it received Certification Approval From the United States/Canada Joint Certification Office, Defense Logistics Information Service.

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RSI's eSight Design for Manufacturability Solution Lowers PCB Manufacturing and Implementation Costs

Industry News | 2003-02-13 08:11:45.0

eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%

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Camtek Introduces the Dragon, a New, Fast AOI System with Fully-automated Material Handling

Industry News | 2003-03-25 09:15:19.0

The Dragon was demonstrated at the CPCA show in Shanghai last week

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SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

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Nam Tai Electronics, Inc. Appoints Mr. Guy Bindels As Research and Development Director

Industry News | 2003-03-05 08:35:10.0

he will be responsible for formulating R&D strategies and spearheading the Company to keep abreast of the latest development in global manufacturing technology as well as strengthen its R&D division.

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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