Industry News | 2010-04-10 02:45:03.0
IPC – Association Connecting Electronics Industries® has announced the winners of this year's Best U.S. and International Papers at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas. The event's Technical Program Committee selected the winners through a ballot process.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2012-01-26 22:32:33.0
BPM Microsystems has added the model 2800ISP In-System Programming Station to its device programming product line. By incorporating its award-winning 8th Generation site technology utilizing Vector Engine® BitBlast into a custom-designed test fixture, BPM Microsystems’ 2800ISP allows customers to program flash architectures including eMMC, PCM and Raw NAND, plus microcontrollers and other device technologies on-board after reflow.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2015-07-20 07:36:12.0
SMTA/NPL Printing & Assembly Automatic Optical Inspection Experience is a special feature we are organising in Chicago this year and we are looking for Solder Paste Inspections SPI and Automatic Optical Inspection systems to test our specially produced boards. If you would like to show your technology contact us bobwillis@smta.org
Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2010-03-17 18:31:55.0
EAST HANOVER, NJ – Zymet has introduced a new silica-filled reworkable board-level underfill encapsulant, X2825, whose coefficient of thermal expansion, CTE, is 26 ppm/°C. The underfill enhances drop and shock test reliability and, compared to higher CTE underfills, provides superior thermal cycle performance.
