Industry News | 2016-06-10 09:45:09.0
Cranston RI - Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara CA. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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