Industry News: bonders (Page 2 of 10)

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Industry News | 2013-04-13 00:16:30.0

Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.

Hesse Mechatronics

Palomar Technologies’ 3800 Ultra Flexible Die Bonder Wins Distinguished Industry Award

Industry News | 2010-10-27 20:21:50.0

Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.

Palomar Technologies

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech

Hesse & Knipps, Inc. Appoints New Technical Training Manager

Industry News | 2012-07-25 10:06:43.0

Hesse & Knipps, Inc.,has appointed Allan Camp as Technical Training Manager.

Hesse Mechatronics

Pennsylvania State University Wins Finetech Die Bonder Donation

Industry News | 2012-08-29 10:27:05.0

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

Finetech

Tresky Automation launches new website

Industry News | 2023-11-20 15:38:12.0

The German DIE Bonder specialist is launching its brandnew website with a fresh corporate design for productronica 2023. The new website includes different focus and structure for the bonder solutions, which should help selecting proper information.

Tresky AG

Hesse & Knipps, Inc. Opens Second Demo and Applications Lab on West Coast

Industry News | 2012-02-15 20:06:32.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH recently opened a West Coast Demo and Applications Laboratory to provide enhanced applications and field support to customers throughout the western region. The Hesse & Knipps Demo and Applications Lab is located at the company’s manufacturer rep - Chalman Technologies - in Anaheim, CA. Hesse & Knipps also maintains an East Coast Demo and Applications Lab in Sterling, MA.

Hesse Mechatronics

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Industry News | 2012-08-14 10:24:59.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario

Hesse Mechatronics

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Industry News | 2013-05-06 18:13:00.0

Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.

Hesse Mechatronics


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