Industry News | 2023-11-20 13:52:50.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product the highly precise photonics bonder at productronica 2023 in Munich. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Industry News | 2023-11-27 12:51:49.0
The German DIE Bonder specialist Tresky GmbH is excited to introduce its latest product, the highly precise photonics bonder. The recently developed bonder is based on a new machine concept. The stable granite base, makes it one of the most precise placement systems on the market. This level of precision is indispensable, especially for use in nano- and optoelectronics.
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Industry News | 2012-08-02 11:15:11.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has strengthened its customer support and wedge bonder representation throughout Northwestern United States and Canada with the appointment of Prospect Technical Sales that will now support the company’s family of wedge bonders in Nevada, Oregon, Washington, Montana, Utah, Colorado, Northern California as well as the Canadian provinces of British Columbia and Alberta.
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2013-04-13 00:16:30.0
Hesse Mechatronics has appointed Michael McKeown as Senior Business Development Manager. Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market.
Industry News | 2010-10-27 20:21:50.0
Palomar Technologies, a leading supplier of solutions for microelectronic and optoelectronic packaging, announces that it has been awarded a Global Technology Award in the category of Bonding Equipment for its 3800 Ultra Flexible Die Bonder.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
