Industry News: bonders (Page 6 of 10)

Fluxless soldering using formic acid vapor for optoelectronics

Industry News | 2023-11-20 15:33:13.0

Soldering using formic acid vapor in combination with nitrogen (HCOOH + N2) offers significant advantages in assembly and connection technology for applications in optoelectronics and photonics. Especially in the field of sub-micron bonding, Tresky has introduced several innovations in recent months and is now presenting the formic acid module for reliable use in bonding processes at productronica 2023.

Tresky AG

FINETECH Appoints Axiomatek as Exclusive Representative in Mexico

Industry News | 2009-01-13 19:26:03.0

FINETECH, a provider of innovative equipment solutions for advanced rework and packaging and assembly applications, announces that Axiomatek will assume sales responsibility for the company's product line in Mexico. Axiomatek is headquartered in Santa Teresa, New Mexico and has multiple offices in Mexico.

Finetech

High Accuracy Die Bonder on display at Semicon West 2009

Industry News | 2009-06-23 19:41:14.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 712 at the upcoming Semicon West, scheduled to take place July 14-16, 2009 at the Moscone Center in San Francisco, Ca.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS 2010

Industry News | 2010-10-04 16:32:22.0

FINETECH will showcase the FINEPLACER® Lambda in booth 706 at the upcoming IMAPS 2010 Exhibition, scheduled for November 2-4, 2010 at the Raleigh Convention Center - Research Triangle in Raleigh, NC.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SPIE Photonics West 2011

Industry News | 2011-01-05 15:36:14.0

FINETECH will showcase the FINEPLACER® Lambda in Booth 2204 at the upcoming SPIE Photonics West exhibition, scheduled for January 22-27, 2011 at the Moscone Center in San Francisco.

Finetech

FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Industry News | 2011-02-14 16:47:35.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

Finetech

FINETECH to Showcase Modular Die Bonder at IMAPS 2011 – Long Beach

Industry News | 2011-09-12 13:16:36.0

FINETECH will showcase the FINEPLACER® Lambda in Booth #306 at the upcoming IMAPS 44th International Symposium on Microelectronics exhibition

Finetech

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

Industry News | 2012-09-05 08:13:47.0

Finetech will showcase the FINEPLACER® Lambda in Booth #505 at the upcoming IMAPS 45th International Symposium on Microelectronics exhibition

Finetech

Kyzen to Unveil Concentrated Aqueous Stencil Cleaner at SMT/Hybrid/Packaging

Industry News | 2013-03-18 13:33:59.0

Kyzen, will exhibit its new AQUANOX® A8820 Advanced Aqueous Stencil Cleaner in Booth # 7-523 at the SMT/Hybrid/Packaging 2013 exhibition and conference, April 16-18, 2013, at the Messezentrum in Nuremberg, Germany.

KYZEN Corporation


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