Industry News: bonders (Page 10 of 10)

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Essemtec to Define a New Standard - Paraquda is the world’s most advanced pick-and-place machine

Industry News | 2009-11-11 13:39:57.0

Paraquda is the newest SMD pick-and-place machine that Essemtec has introduced at the Productronica exhibition in Munich, Germany. The machine sets a new standard for flexible placement machines: Drive technologies, materials and software are state-of-the-art, machine operation is a user friendly and the application range is wider than ever before.

ESSEMTEC AG

Highly Flexible and Fast SMD Assembly Machine - Essemtec Introduces New Cobra Pick-and-Place System at SMTA International

Industry News | 2010-09-29 23:17:20.0

Cobra is one of the most modern SMD pick-and-place systems in the world. Latest drive and material technologies combined with quick changeover concepts make it an extremely reliable, fast and flexible workhorse for both high-volume and high-variety production.

ESSEMTEC AG

ASM Pacific Technology Announces 2020 Annual Results

Industry News | 2021-03-15 15:34:56.0

ASM Pacific Technology Limited ("ASMPT" / the "Group") (Stock code: 0522) announced its annual results for the year ended 31 December 2020. ASMPT's technologies enable its diverse range of customers to create a wide range of semiconductor and electronic products and services for the digitally-enabled world.

ASM Pacific Technology

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