Industry News: bonders transducer (Page 1 of 1)

Pennsylvania State University Wins Finetech Die Bonder Donation

Industry News | 2012-08-29 10:27:05.0

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

Finetech

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Industry News | 2013-10-31 11:53:09.0

Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics

Donated Finetech Die Bonder Installed at Pennsylvania State University

Industry News | 2013-03-11 09:10:32.0

A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech

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