Industry News | 2012-08-28 09:54:11.0
Count On Tools Inc., announces a breakthrough in custom nozzle engineering for ultra-smooth components from the semiconductor market.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2014-07-16 20:05:16.0
Backward Compatible G4C Ceramic Hot Bars Designed for Legacy TC-1000 and TC-1200 Toddco Temperature Controllers
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2007-11-08 21:34:39.0
Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.
Industry News | 2017-02-28 20:41:01.0
PDR is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems. The PDR IR-TS One Bench Top System and TS-2100 Cabinet System have been designed to thermally cycle key critical components and assemblies to detect defects. Applications include testing electronic assemblies, electronic devices, bonded structures of plastics and ceramics in a wide variety of fields, including medical, automotive, avionics, space and defense.
Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Industry News | 2018-09-18 19:55:05.0
NEO Tech announces that it received reaccreditation by the Department of Defense, Defense Microelectronics Activity (DMEA), furthering its reputation as a leader in the microelectronics industry.
Industry News | 2019-05-15 17:09:30.0
NEO Tech announces that it will highlight its high-reliability microelectronics solutions and higher level integration experience at the 2019 Space Tech Expo, which is scheduled to take place May 21-22, 2019 at the Pasadena Convention Center in California.
Industry News | 2016-02-06 00:54:37.0
Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.
